Rajeev Chandrasekhar, Union Minister of State for Electronics and IT, yesterday said that the government will approve multiple semiconductor packaging and fabrication plant proposals in the coming weeks, as the Centre or the federal government reopened the window for fresh fab applications for leading and mature nodes.

On June 1, the window for reapplying for government incentives under the modified semiconductor scheme opened.

“@GoI_MeitY has reopened the window for fresh fab applications for leading and mature nodes. This is being done since the January 2022 window was closed before the policy was improved to encourage mature nodes with equal incentives,” the Minister said in a tweet.

The government, said Chandrasekhar, has already approved many semiconductor design companies and received packaging and mature node fab proposals, IANS reported from New Delhi.

According to the Minister, current and new players may reapply in various nodes.

“We are now reopening the window for semiconductors, which will remain open indefinitely.” “We are allowing current applicants to reapply for more mature nodes,” Chandrasekhar explained.

The government recently announced the launch of a Rs 76,000 crore production-linked incentive (PLI) scheme for semiconductor and display manufacturing units.

According to a recent joint report by Counterpoint Research and the India Electronics and Semiconductor Association (IESA), India’s semiconductor market was valued at $22.7 billion in 2019.