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Apple, Broadcom sign $30 billion chip deal 
Apple has signed a multiyear agreement worth more than $30 billion with Broadcom to manufacture advanced wireless technology and custom chip components in the United States. The deal is part of Apple’s effort to strengthen local chip production and build a more secure supply chain.
According to Apple, the partnership will lead to the production of more than 15 billion US made chips and support hundreds of manufacturing jobs. It is also Apple’s biggest commitment under its American Manufacturing Program (AMP).
As part of the agreement, Broadcom will invest $1.5 billion to expand its manufacturing facility in Fort Collins, Colorado. The facility will produce advanced FBAR filters and radio frequency components that help power wireless connectivity in Apple devices.
Apple CEO Tim Cook said the partnership will further support American manufacturing and innovation. He added that these components are important for delivering strong connectivity and performance across Apple products.
